SemiAnalysis Weekly

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Everything semiconductors and AI

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Every hybrid bonder on the market today brings the die to the wafer. ASML's patents bring the wafer to the die.Sherry Zhang and Howie join Jordan Nanos (@jordananos) to dig into the patents behind ASML's die-to-wafer hybrid bonder, why a track-based design could beat Besi on alignment and particle control, and why HBM won't adopt die-to-wafer hybrid bonding before 2029. The team also looks at how China is using hybrid bonding to keep scaling past its lithography limits, and what larger photomasks mean for High-NA EUV.Chapters:0:00 The Patent Tip-Off1:53 Hybrid Bonding 1014:06 Die-to-Wafer vs Wafer-to-Wafer5:43 Back End vs Front End8:05 Why HBM Waits Until 202913:45 Everything Comes to the Die18:26 Alignment and Cleanliness22:48 Bonding Instead of Shrinking25:49 China's Toolmakers Step Up28:25 Bigger Masks for High-NA33:29 Two Tool Stacks?Read the full article: ASML Is Building a Hybrid Bonding Tool!https://newsletter.semianalysis.com/p/asml-is-building-a-hybrid-bonding

Epizode

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Ep. 040 - ASML Is Building a Hybrid Bonding Tool, and Its Patents Show How (AI Supply Chain) | Jordan Nanos, Howie, Sherry Zhang

Every hybrid bonder on the market today brings the die to the wafer. ASML's patents bring the wafer to the die.Sherry Zhang and Howie join Jordan Nanos (@jordananos) to dig into the patents behind ASML's die-to-wafer hybrid bonder, why a track-based design could beat Besi on alignment and particle control, and why HBM won't adopt die-to-wafer hybrid bonding before 2029. The team also looks at how China is using hybrid bonding to keep scaling past its lithography limits, and what larger photomasks mean for High-NA EUV.Chapters:0:00 The Patent Tip-Off1:53 Hybrid Bonding 1014:06 Die-to-Wafer vs Wafer-to-Wafer5:43 Back End vs Front End8:05 Why HBM Waits Until 202913:45 Everything Comes to the Die18:26 Alignment and Cleanliness22:48 Bonding Instead of Shrinking25:49 China's Toolmakers Step Up28:25 Bigger Masks for High-NA33:29 Two Tool Stacks?Read the full article: ASML Is Building a Hybrid Bonding Tool!https://newsletter.semianalysis.com/p/asml-is-building-a-hybrid-bonding

23 окт. 2026
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Ep. 039 - [EMERGENCY] Our Numbers Are "Insane." Here's the Proof. (Datacenters) | Jeremie Ontiveros, Reyk Knuhtsen, Jordan Nanos

Brad Gerstner put our 43 gigawatt forecast for 2027 on All-In, then again in his BG2 sit-down with Jensen, and called it too aggressive. The consensus counter sits near 25 GW, built on moratorium headlines and grid connection fears. Jordan Nanos (@JordanNanos) sits down with Jeremie Ontiveros (@JeremieEO) and Reyk Knuhtsen (@robotknower), who have been tracking the same capacity curve since March 2024, and it has barely moved across every model revision. So they aren't cutting it. They're raising it. Read the article: https://newsletter.semianalysis.com/p/datacenters-2027-the-year-of-acceleration 0:00 Cold Open 1:17 The 2027 Forecast Debate 2:21 Model Track Record 5:27 Where the Pushback Comes From 8:16 Delays and Haircuts 12:31 The Top 40 Sites 15:23 Leading Indicators 20:40 Modular Builds 25:41 Chips vs Datacenters 27:53 Responding to Brad Gerstner

20 окт. 2026
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Ep. 038 - GLM 5.3 on AMD, NVIDIA, and Chinese Chips From Day One (InferenceX) | Kimbo Chen, Wenyao Gao, Jordan Nanos

GLM 5.3 only attends to the tokens that matter. It still has to keep every one of them. Kimbo Chen (@kimbochen) and Wenyao Gao (@gao_wenyao) join Jordan Nanos (@JordanNanos) to dig into AMD catching NVIDIA on InferenceX, how post-training alone pushed an open-weight model within reach of Mythos, and whether Z.ai quietly tuned it for Chinese chips. The team also looks at how GLM 5.3 became a fallback when Claude and GPT refuse security work. Chapters: 0:00 Cold Open 0:37 Sparse Attention 101 4:46 HiCache and HiSparse 10:13 AMD Catches NVIDIA 12:54 Capacity vs Bandwidth 18:44 The Frankenstein Flash 20:09 Mythos-Class From China? 22:52 Post-Training Pipeline 32:32 Chinese Chips, Day One 39:54 GLM 5.4 and Beyond Read the full article: How GLM 5.3 Sparse Attention Affects HBM Memory Usage https://newsletter.semianalysis.com/p/sparse-savings-persistent-demand-inside-glm53

14 окт. 2026
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Ep. 037 - Who's Funding the $11 Trillion AI Buildout? (Capital Markets) | Dan Nishball, Jordan Nanos

H100 rental prices went up, on a GPU that should be sliding down its depreciation curve. That curve is what lenders underwrite. Daniel Nishball (@dnishball) kicks off our new Compute Capital Markets group by following the money through Nvidia's $497B backstops, ClusterMAX as a credit signal, and whether each token is profitable. Jordan Nanos (@JordanNanos) brings the rental data. AI debt is about to pass auto loans. 0:00 Opening 1:48 Nvidia's Backstop Universe 6:22 The $11T Funding Wall 17:25 Balance Sheet as a Service 26:27 ClusterMAX as Credit Risk 31:51 Why H100 Prices Rose 43:09 Token Profitability 58:05 You Can't Go Back 1:07:25 AI Debt vs Auto Loans 1:11:14 Inside Nvidia's Backstops

09 окт. 2026
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Ep. 036 - $200 Buys $12,000 of Opus Tokens, We Bought Every Plan (AI Cloud TCO) | Max Kan, Jordan Nanos, Andrew Megalaa

Pay Anthropic $200 a month and you can pull $12,000 of Opus 5.5 tokens at API pricing. Max Kan (@maxkan) and Andrew Megalaa bought every plan, OpenAI, Meta, xAI, MiniMax, Moonshot, Z.ai, Cursor, and measured every token type to find the ceiling. The catch isn't subsidy. Anthropic still books 50 to 60% gross margins on these plans, which means the API itself is the price gouge. 0:00 Cold Open 1:03 Subsidies and Credits 5:23 Token Types and Cache 14:08 Model Value Charts 20:51 Test Methodology 26:54 Other Plans 31:26 Utilization and Limits 36:24 Token Efficiency 41:24 Open Models 44:22 Cyber and Capture Read More: https://newsletter.semianalysis.com/p/anthropic-subscriptions-offer-5x

07 окт. 2026